Welcome, introduction and EUFANET status update - Philippe
Perdu and Christian Boit (EUFANET_Program_2004-final.pdf)
TEM analysis of gate oxide breakdown damage - Joachim
Reiner from EMPA (EUFANET_EMPA.pdf)
In-situ sample preparation and high-resolution SEM-STEM
analysis - Marc-Olivier Casari from FEI (EUFANET_FEI.pdf)
3D (360degree) failure characterization in semiconductor
devices using Hitachi's FIB/STEM system FB-2100/HD-2300
- Dr. Roland Schmidt (Hitachi). Dr Schmidt gives us
a Hitachi paper on this (EUFANET_HITACHI.pdf)
n3-D TEM Tomography - An Evaluation of a Commercially Available System -
Thomas Schweinboeck from
Infineon(EUFANET_INFINEON.pdf)
EUFANET workshop report: Debate on 3D imaging
by Romain Desplats from CNES (Eufanet
Esref2004 summary.pdf)
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