|
 The
6th EUFANET workshop focused on Failure Analysis
of System in Package (SIP). It has been held during the ESREF 2006 conference
in Wuppertal, Germany. 49 people attended this exiting
workshop where we had great technical exchanges and
discussions which followed the presentations:
|
Welcome
and EUFANET status update (download presentation)
Philippe
Perdu, CNES and Felix Beaudoin, CREDENCE
|
|
System
in Package and Failure Analysis Challenges
(download abstract,
presentation)
Patrick
Poirier, LaMIP/PHILIPS
|
|
Open
Degradation on ITO Lines for an LCD Driver
(download abstract,
presentation)
Peter
JACOB, EMPA
|
|
Evaluation
of risks due to thermal stress before physical
failure appearance (download abstract,
presentation)
Michael
Hertl, INSIDIX
|
|
Acoustic
microscopy applied for SiP Physical analysis
(download abstract,
presentation)
Yves
Ousten, Bruno Levrier, Jean Augereau, Laurent
Bechou, IXL ENSEIRB
|
|
Addressing
the Challenge of Backside Circuit Edit of
Wafer Level Chip Scale Packages (download
abstract,
presentation)
Ted
Lundquist, D. Di Donato, T Malik, CREDENCE
|
|
Localization
of Electrical Shorts in Dies and Packages
using Magnetic Microscopy and Lock-in Thermography
(download abstract,
presentation)
Andreas
Altes, Martin Hechtl, INFINEON
|
|
Magnetic
Current Imaging to "see through"
System in Package Devices (download abstract,
presentation)
Lee
Knauss, NEOCERA
|
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Closing
remarks
|
We
thank all the speakers for contributing to the EUFANET
workshop. !
|
