13th EUFANET Workshop @ ESREF 2013. This short workshop (in conjunction with ESREF) (www.esref.org) on "Sample prep challenges and solutions" was held in Arcachon (France)

After a short introduction, the presentations were on the following topics:

1-De-Packaging

• How to open packages with copper wires and “hard” resin?
• Laser Removal of Gel Encapsulants Down to Die
• InGaN Green LED depackaging case study
• Decapsulation of Silver-Alloy-Wire-Bonded Devices

2-Re-Packaging

• Ceramic DIL modifications for backside OBIRCH/ Emission microscopy
• Sample repackaging for backside analysis

3-Silicon Thinning

• Uniformly Thinning Contoured Silicon to ±5 μm Tolerance
• How to overcome sample prep challenges to fit High NA SILrequirements?

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